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Royce 650 Universal Bond Testers
PID: 775080
Model No: 0
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Supplier Details
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TELTEC SEMICONDUCTOR PACIFIC (TAIWAN) LTD.
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新竹縣竹北市台元科技園區台元街28號6樓之6
+886-3-5525323
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Key Features
Royce 650 bond tester systems can handle a variety of testing applications including wire pull, Die Shear, Bond Shear, 3-Point Bend. Royce 650 bond tester to be utilized throughout the leading semiconductor and largest auto and medical electronics device manufacturers. Wide range of applications, wire Die Shear, pull, Bond Shear and 3-Point Bend test.
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