Thermally Conductive Adhesive Double Tape
PID:
657233
Model No:
5715
Made in:
Taiwan
Quantity:
1000 Piece(s)Available
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Payment:
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Supplier Details
WEGOT ELECTRONICS CO., LTD.
Member Since
2010
Address
1F., No.49, Zhonghua St., Xizhi Dist., New Taipei City 221, Taiwan (R.O.C.)
+886-2-86477480
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Key Features
Product Description
Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating modules, metallic structures, and machine casings. When the product is applied, heat is conducted away from sensitive components while uneven surfaces are properly flattened and filled.
• This tape offers excellent adhesive performance with good wetting and soft onto many substrate surfaces. These tapes offer both good thermal conductivity and good electrical insulation properties.
• This tape is acrylic pressure sensitive adhesives loaded with thermally conductive fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface.
• The specialized chemistry of tape 5715 provide modestly soft and able to wet to many surfaces, allowing them to conform well to non-flat substrates, provide high adhesion, and act as a good thermal interface.
• The thermally conductive tape is provided on a silicone treated polyester release liner for ease of handling and die cutting.
• If any re-work is needed, the adhesive could be torn off and will leave behind with no res
Application Guide
1.) Substrate surfaces should be clean and dry prior to tape application. Allow the surface to dry for several
minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or
toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but
should be followed by a final isopropanol wipe as described above..
2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger
pressure to help reduce the potential for air entrapment under the tape during its application. The liner can
be removed after positioning the tape onto the first substrate.
3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate
surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature
applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air
entrapment as most rigid parts are not flat. Flexible substrates can be bonded to rigid or flexible parts with
much less concern about air entrapment because one of the flexible substrates can conform to the other
substrate.
Attachment
