Low CTE & High Modulus Polyimide Film (PIA)

PIA is a new generation polyimide film applied for the FPCs. It is a kind of heat resistant film possessing excellent physical, chemical, and electrical properties, and has the low CTE, high modulus, perfect dimensional stability functiality.It is the best solution for the fine pitch pattem application due to its superior dimensional stability and lower coefficient of thermal expansion functionality.

Features:

1, Perfect Dimensional Stability

2, High Modulus

3, Low Coefficient of Thermal Expansion

4, Lower Stiffness

5, High Temperature resistance

6, Excellent Electrical resistance

7, Outstanding duration and reliability

Applications:

1, The substrates of Flexible Printed Circuits (FPC).

2, Perfect solution for the fine pitch pattern.

3, Specialty Fabricated Products (SFP).

4, The adhesive tape for the IC packaging.

5, Motor / Generator (M/G)slot liners.

6, Protection Tape.

7, Pressure Sensitive Tape (PST).

8, Wire and Cable (W&C).