The Brimful-Glue Removing Machine for IC & Diode & Passive Components
PID:
33241
Model No:
0
Made in:
Taiwan
Quantity:
1000 Piece(s)Available
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Payment:
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Supplier Details
RICH SOU TECHNOLOGY CO., LTD.
Member Since
1986
Address
NO. 27,CHUKUNG 2ND LANE, JEN WU DIST.,KAOHSIUNG, TAIWAN
+886-7-3716924
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Key Features
IC & Diode & Passive Components.(RSG-1202)1.Dimension(L/W/H) : 2150 x 1100 x 2150 mm.2.Motor: 1 HP.3.Removing Spilled Glue Way: Conveyance.4.Height of Blasting nozzle to mold: Free Adjustment by processing media.5.Conveying speed: Free Adjustment by Processing media.
