Introducing our leading Thermal Gap Filler Provider, specializing in high-performance thermal gap fillers. Our flagship product, TG-A38KX, is engineered to deliver exceptional thermal conductivity, ensuring efficient heat transfer between critical components. Crafted using a specialized process, TG-A38KX combines silicone as the base material with thermal conductive powder and flame retardants, forming an advanced thermal interface material. This formulation effectively reduces thermal resistance between the heat source and heat sink, optimizing performance and reliability. Our thermal gap filler stands out for its remarkable features. It boasts great thermal conductivity, which is essential for maintaining optimal temperatures and preventing overheating. We welcome your inquiries.
- Great thermal conductivity
- Difficult to be deformed
- Easy to assemble
- By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A38KX has great thermal conductivity, it’s difficult to be deformed and easy to assemble. With Protection, impact absorption, flame resistance, and good fit.
Product applications:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
- Thermal Conductivity: 3.8±10% W/m•K
- Thickness: 0.3~10.0 mm
- Color: Blue
- Flame Rating: V-0
- Dielectric Breakdown Voltage: ≥10 KV/mm
- Weight Loss: <1 %
- Density: 3.1±5% g/cm³
- Operating Temperature: -40~+200 °C
- Volume Resistivity: 3x10¹² Ohm-m
- Elongation: 110 %
- Standard Format: Sheet
- Hardness(Silicone Side): 60｜±10 Shore OO
As a leading supplier of advanced thermal management solutions, we proudly present our Thermal Gap Filler with Exceptional Thermal Conductivity, designed to enhance the efficiency and reliability of various electronic applications. Our state-of-the-art TG-A38KX thermal gap filler embodies cutting-edge technology, leveraging a unique manufacturing process that combines silicone with high-performance thermal conductive powders and flame retardants. This innovative mixture forms a superior thermal interface material, effectively reducing thermal resistance between heat sources and heat sinks, ensuring optimal heat dissipation.
Our thermal gap filler is distinguished by its remarkable thermal conductivity of 3.8±10% W/m•K, which guarantees efficient heat transfer and minimizes heat build-up in critical components. The material is engineered to resist deformation, maintaining its integrity under pressure and extended use. Additionally, its easy assembly feature simplifies the application process, making it a user-friendly choice for various industries.
Designed to perform under extreme conditions, TG-A38KX excels in temperature resilience, functioning effectively in a broad temperature range from -40°C to +200°C. Its high electrical insulation properties and self-adhesiveness eliminate the need for additional adhesives, ensuring a smooth and reliable heat conduction path. The gap filler also offers excellent impact absorption, flame resistance (Flame Rating: V-0), and a low weight loss of less than 1%, enhancing its durability and performance in demanding environments.
This versatile thermal pad is suitable for a wide array of applications, including electronics (such as 5G, AI, and AR/VR), automotive components, power supplies, and industrial equipment. Its robust features make it an ideal choice for industries requiring reliable thermal management, including aerospace, consumer electronics, energy storage, medical devices, and more.
In summary, our TG-A38KX Thermal Gap Filler stands out for its superior thermal conductivity, ease of use, and resilience, making it an essential component for high-performance thermal management solutions. With its exceptional properties and wide-ranging applications, it offers a cost-effective solution for maintaining the efficiency and longevity of various electronic and industrial products.
