As a leading Thermal Conductive Paste Provider, we specialize in offering high-quality thermal conductive solutions designed to enhance thermal management in various applications. Our product range includes thermal conductive paste, thermal conductive glue, and heat conductive paste, each engineered to deliver superior performance and reliability. Our premium thermal conductive paste features a silicone-type spacer that ensures exceptional long-term reliability. With a thermal resistance lower than conventional thermal pads, our paste optimizes heat transfer between heat sources and heatsinks. Its unique physical properties strike a perfect balance between liquid and solid states, allowing it to fill gaps effectively and provide consistent thermal conductivity. Feel free to get in touch with us at your convenience.
- Silicone-type spacer with great long term reliability
Lower thermal resistance than thermal pads
Physical property between liquid and solid state
Elimination of different gap between heat source and the heatsink
Can be applied with dispenser
TG4040 is a thermal putty and a gap filler between solid and liquid with excellent thermal conductivity of 3.2W/m•K, low thermal resistance, and excellent long-term reliability. Only a small amount of TG putty is needed to fill the uneven gaps. This improves the flexible processability of the manufacturing end, is thinner, does not overflow, and does not harden, which is very suitable for components that do not require high-strength mechanical structural bonding, and provides better thermal conductivity.
The thermal conductivity of TG4040 PUTTY reaches 3.2W/mK. Its thermal conductivity method is the same as that of thermal pads. TG4040 PUTTY products are very suitable for applications where thermally conductive silicon films cannot become the first choice, including the current very popular electric vehicles, as well as power supply, 5G communications, etc. It is between solid and liquid from TG. It’s one of the major advantages is its easy-to-spread characteristics. It is more suitable for uneven surfaces than thermal conductive silicon film Application, and more evenly fills the gap between the thermal component and the heat sink. The heat transfer can be maximized, and finally, the heat is dissipated through the radiator. And because it can be used as a thin layer, thermally conductive paste can provide better thermal conductivity and lower thermal mass than thermally conductive silicon film.
- Thermal Conductivity: 3.2±0.3 W/m•K
- Color: Blue
- Operating Temperature: -50~+180 °C
- Density: 2.9±5% g/cm³
- Viscosity: 250(±100) Pa·s
- Volume Resistivity: 10¹³ Ohm-m
- Standard Package: Tube/Pot
As a leading provider of high-performance thermal management solutions, we proudly present TG4040, a high stability thermal conductive paste designed to meet the demanding needs of modern electronics. TG4040 is a silicone-type spacer offering superior long-term reliability and exceptional thermal conductivity with a K value of 3.2 W/m•K. Unlike traditional thermal pads, TG4040 boasts a lower thermal resistance, enhancing heat transfer efficiency while filling gaps with precision.
TG4040's unique formulation bridges the gap between liquid and solid states, providing an ideal solution for uneven surfaces and varying gaps between heat sources and heatsinks. This gap-filling capability is crucial for maintaining optimal thermal performance in a range of applications, including electric vehicles, power supplies, 5G communications, and advanced consumer electronics. The paste's flexible nature allows for easy application using a dispenser, ensuring an even spread without overflow or hardening over time.
The versatility of TG4040 makes it particularly suitable for components that do not require high-strength mechanical bonding but demand excellent thermal conductivity. Its easy-to-spread characteristics and ability to conform to irregular surfaces make it a preferred choice over thermally conductive silicon films in many scenarios. This results in enhanced heat dissipation through the radiator, effectively managing thermal loads in diverse electronic devices.
TG4040 is engineered to withstand a wide operating temperature range from -50°C to +180°C, making it suitable for both high and low-temperature applications. With a density of 2.9±5% g/cm³ and a viscosity of 250(±100) Pa·s, it offers consistent performance across various environments. The product's volume resistivity of 10¹³ Ohm-m further ensures reliable electrical insulation.
Available in blue and packaged in tubes or pots, TG4040 is an excellent choice for industries ranging from aerospace and automotive to medical and industrial sectors. Whether for advanced AI systems, energy storage solutions, or telecommunications, TG4040 provides unparalleled thermal management, making it an indispensable tool for optimizing the performance and longevity of high-tech components.
