As a premier absorbing material supplier, we specialize in high-performance solutions designed to absorb electromagnetic radiation effectively. Our products are engineered to absorb material with exceptional efficiency, making them ideal for a variety of applications. Our absorbing materials boast an ultra-thin and extremely flexible design, allowing them to be freely arranged in any space to meet your specific needs. The non-conductive adhesive backing, which is UL Recognized, ensures reliable and secure application. These materials are particularly effective in preventing resonance and suppressing coupling, offering superior performance in electromagnetic interference (EMI) control. We welcome your inquiries.

Features

• Ultra thin and extremely flexible, can be freely arrangrd in space.
• Non-conductive adhessive backing(UL Recognized) available
• Effective in preventing resonance and suppressing coupling.
• High Surface resistance (10^6-10^9ohms)　
• Easy and fast to process　
• Can be cut any shape easily
• Notebooks, PCs, workstations, Mobile communications equipment, Base stations for mobile phones and Peripheral devices for computers, Wireless equipment, Mobile phones, PHS, High speed clocks, RFID (Radio Frequency Identification) systems, NFC (Near field communication) , Wireless charger

As a leading supplier of innovative absorbing materials, we proudly offer a cutting-edge solution designed to enhance electronic performance and reliability. Our advanced material excels in preventing resonance and suppressing coupling, making it an essential component for a range of applications in the electronics industry.

Our absorbing material is characterized by its ultra-thin and exceptionally flexible nature, allowing it to be seamlessly integrated into various electronic devices and systems. With its non-conductive adhesive backing, which is UL recognized, the material adheres firmly without interfering with the device's performance. This feature is particularly beneficial for applications requiring precise alignment and stability. The material's high surface resistance, ranging from 10^6 to 10^9 ohms, ensures effective suppression of electromagnetic interference, contributing to cleaner signal transmission and enhanced overall device functionality.

This material is designed to be easily processed, allowing for quick and efficient customization. It can be cut into any shape, making it adaptable to diverse design requirements and space constraints. Whether used in notebooks, PCs, workstations, mobile communication equipment, base stations for mobile phones, or peripheral devices, its versatility is unmatched. It is also ideal for wireless equipment, mobile phones, PHS, high-speed clocks, RFID systems, NFC technology, and wireless chargers.

Our product specifications include a frequency range of 0.001 to 3.0 GHz, ensuring compatibility with a broad spectrum of electronic devices. It is available in various thicknesses (0.08, 0.12, and 0.22 mm) and can be produced in sizes up to 130×130 mm. The material operates efficiently within a temperature range of -30 to +120 °C and boasts a density of 3.8 g/cm³. Made from sintering iron-core with a magnetic inductivity (μ'@1MHz) of 140, it is halogen-free, making it a safer and environmentally friendly choice. The structure comprises PET tape, FAM, two-sided adhesive tape, and release paper, with optional dual-side adhesive tapes for added convenience.

Our absorbing material stands at the forefront of technological advancement, offering unmatched performance in resonance prevention and coupling suppression for a wide array of electronic applications.