Welcome to our premier thermal putty manufacturer, where cutting-edge technology meets exceptional reliability. Our product line includes top-quality silicone putty, thermal putty, and thermal filler designed to enhance thermal management in your applications. Our silicone-type spacer stands out with its outstanding long-term reliability, ensuring optimal performance over time. Unlike traditional thermal pads, our thermal putty offers significantly lower thermal resistance, providing superior heat dissipation and efficiency. The unique physical properties of our thermal filler blend the best attributes of liquid and solid states, making it versatile for various applications. Feel free to get in touch with us at your convenience.
- Silicone-type spacer with great long term reliability
- Lower thermal resistance than thermal pads
- Physical property between liquid and solid state
- Elimination of different heat source gap & heat sink
- Can be applied with dispenser
- TG-A7000 is a thermal putty T-Global has developed for the mortar industry with 7.0 W/m•K ultra-high thermal conductivity. It optimizes the heat dissipation performance of the product also it has an ultra-low heat group. This thermally conductive mortar is paste-like paste stickers, product design does not need to take special consideration of product size and tolerance restrictions, and can be flexibly designed according to the optimal effect of the design.
- Thermally conductive gels are widely used in LEDs, microprocessors, memory modules, cache memories, sealed integrated chips, DC/DC converters, IGBTs and other power modules, power semiconductors, solid-state relays, and bridge rectifiers.
Product applications:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
- Thermal Conductivity: 7.0 W/m•K
- Color: Green
- Operating Temperature: -50~+180 °C
- Density: 3.25/cm³
- Viscosity: 250±100 Pa·s
- Volume Resistivity: 10¹³ Ohm-m
- Standard Package: Tube/Pot
As a leading provider of advanced thermal management solutions, we proudly offer our TG-A7000 thermal putty, engineered to deliver exceptional heat dissipation in various industrial applications. This cutting-edge thermal putty combines the best attributes of liquid and solid states, offering a unique solution for managing thermal challenges.
TG-A7000 stands out with its silicone-type composition, designed for superior long-term reliability. With a thermal conductivity of 7.0 W/m•K, it outperforms traditional thermal pads by providing lower thermal resistance and enhancing the efficiency of heat dissipation. This product's innovative formula bridges the gap between liquid and solid states, making it ideal for applications that require flexibility and precision. Its paste-like consistency allows for easy application using a dispenser, ensuring even distribution and optimal thermal performance.
One of the key advantages of TG-A7000 is its ability to eliminate gaps between different heat sources and heat sinks. This ensures a more effective thermal transfer, reducing the risk of overheating and extending the lifespan of electronic components. The putty's ultra-low heat group further contributes to its outstanding performance, making it suitable for demanding environments where efficient heat management is critical.
The versatility of TG-A7000 makes it an excellent choice for a wide range of applications, including but not limited to LEDs, microprocessors, memory modules, DC/DC converters, power semiconductors, and bridge rectifiers. Its applications span across various industries such as 5G technology, aerospace, artificial intelligence (AI), automotive, consumer electronics, energy storage, and medical devices. Whether used in electronic products, industrial machinery, or advanced lighting equipment, TG-A7000 provides reliable thermal management solutions.
With a broad operating temperature range of -50°C to +180°C and a density of 3.25/cm³, TG-A7000 meets the stringent requirements of modern technological applications. Its viscosity of 250±100 Pa·s and volume resistivity of 10¹³ Ohm-m ensure that it maintains its performance under different conditions.
Available in convenient tube or pot packaging, TG-A7000 is designed to meet the needs of various industries and applications, delivering exceptional performance and reliability in thermal management.
