Introducing our premier Thermal Gap Pad Manufacturer, specializing in high-performance thermal interface materials. Our innovative thermal gap pads are crafted from a silicone base, engineered to optimize thermal conductivity and insulation efficiency. Utilizing advanced silicone technology, our products are enhanced with thermal conductive powders, flame retardants, and other additives to ensure superior performance. The unique synthesis process of our thermal gap pads significantly reduces thermal contact resistance, bridging the gap between heat source surfaces and cooling devices. This enhancement improves heat transfer efficiency and ensures reliable thermal management in various applications. Feel free to get in touch with us at your convenience.

Features

• High Thermal Conductivity Characteristics
• Low Thermal Resistance
• Excellent Insulation
• This thermal interface material is based on silicone and enhanced with thermal conductive powders, flame retardants, and other additives. It is synthesized through a special process to effectively reduce the thermal contact resistance between the heat source surface and the cooling device.
• The product features a high thermal conductivity coefficient and flexible, elastic properties that allow it to conform to uneven surfaces. This ensures efficient heat transfer from the heat source to the metal casing or heat spreader, thereby improving the efficiency and lifespan of heating electronic components.
• It is highly suitable for high-performance products such as electric vehicles, automation systems, 5G applications, servers, and other high-wattage electronic devices. This silicone-based material, with added thermal conductive powders and flame retardants, is designed to minimize thermal contact resistance effectively.

Product applications: 

Electronic components, electric vehicles, 5G, autonomous driving systems, smartphones, the Internet of Things (IoT), high-performance computing, servers, integrated circuits, central processing units (CPUs), metal oxide semiconductors, LEDs, motherboards, power supplies, heat sinks, LCD TVs, laptops, personal computers, telecommunications equipment, wireless hubs, DDR II modules, and more.

As a leading provider of high-performance thermal management solutions, we are proud to offer our top-tier High Performance Thermal Gap Pad with a silicone base. This advanced thermal interface material is meticulously engineered to meet the rigorous demands of today’s high-tech and high-wattage electronic applications. 

Our Thermal Gap Pad excels in delivering exceptional thermal conductivity with a coefficient of 16.6 W/mK. This superior thermal performance is achieved through the integration of high-quality thermal conductive powders and flame retardants within a silicone matrix. The result is a material that not only reduces thermal contact resistance but also enhances overall heat dissipation, crucial for maintaining the efficiency and longevity of electronic components.

Designed with flexibility and elasticity in mind, our Thermal Gap Pad easily conforms to uneven surfaces, ensuring a seamless interface between heat sources and cooling devices. This adaptability is essential for applications in diverse fields such as electric vehicles, 5G technologies, autonomous driving systems, and high-performance computing. Whether used in smartphones, servers, integrated circuits, or power supplies, the pad’s excellent insulation properties and low thermal resistance make it an indispensable component in managing heat effectively.

Our pad is available in a range of thicknesses from 0.5 to 2.0 mm and can be supplied in various formats, including pads, sheets, and die-cut shapes, to accommodate different application needs. The material’s 65 Shore 00 hardness ensures a balance between conformability and durability, while its dielectric breakdown voltage of 5 kV/mm provides reliable electrical insulation. 

The grey-colored pad is not only functional but also designed to meet the aesthetic and practical needs of modern electronic assemblies. Its ability to withstand high temperatures and its flame retardant properties further contribute to its reliability and safety in demanding environments.

In summary, our High Performance Thermal Gap Pad with a silicone base stands out as a robust, versatile solution for efficient thermal management across a broad spectrum of high-performance electronic applications.