Our advanced thermal solutions are designed to meet the rigorous demands of modern electronics, offering top-tier performance for effective heat management. As a leading thermal gap filler supplier, we provide materials that excel in thermal conductivity, ensuring efficient heat dissipation for a wide range of electronic devices. Our thermal gap fillers are engineered to fill the smallest gaps between components, maximizing surface contact and minimizing thermal resistance.

In addition to gap fillers, our product line includes high-performance thermal gel. This versatile material is ideal for applications requiring easy application and excellent thermal conductivity. Our thermal gel is engineered to conform to irregular surfaces, providing a reliable thermal interface that ensures consistent heat transfer even under varying operational conditions. This product is perfect for applications where traditional thermal pads or pastes may not provide adequate coverage or performance.

For those seeking non-silicone alternatives, our non-silicone thermal paste offers a solution that combines high thermal conductivity with the absence of silicone oils, which can be a concern in some applications. This paste is ideal for sensitive electronics and optical devices, where the presence of silicone might lead to contamination or degradation over time. Our non-silicone thermal paste ensures optimal performance without compromising the integrity of your sensitive components.

These products are essential for maintaining the longevity and reliability of your electronic devices by effectively managing heat dissipation. Whether you need a reliable thermal gap filler, a high-performance thermal gel, or a non-silicone thermal paste, our products deliver the performance you need for demanding applications. Please feel free to contact us.

Features

• High Thermal Conductivity: Provides excellent heat transfer capabilities with thermal conductivity up to 8.0 W/m·K, ensuring efficient cooling of electronic components.
• Silicone-Free Formulation: This product is free from silicone, making it suitable for applications where silicone contamination needs to be avoided, such as in optical devices or sensitive electronic components.
• Low Thermal Resistance: Offers low thermal resistance, ensuring minimal loss of heat during transfer, which contributes to the overall efficiency of the cooling process.
• Soft and Compressible: The material is soft and easily compressible, allowing it to conform to irregular surfaces and fill gaps effectively, which improves the thermal interface between components.
• Excellent Electrical Insulation: Provides high dielectric strength, making it an effective insulator that prevents electrical short circuits in electronic devices.
• Wide Operating Temperature Range: Capable of functioning within a broad temperature range, from -50°C to 200°C, ensuring reliability in various environments and applications.
• Non-Flammable: The material is non-flammable, offering an additional layer of safety in applications where fire resistance is critical.
• Eco-Friendly and RoHS Compliant: The product is environmentally friendly and complies with RoHS (Restriction of Hazardous Substances) standards, making it suitable for use in green and sustainable technology applications.
• Versatile Application: Ideal for use in a variety of industries including telecommunications, automotive, consumer electronics, and industrial devices, where efficient thermal management is critical.
• Ease of Handling and Application: The product is designed for easy handling and application, reducing the time and effort required during the assembly process of electronic devices.