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Trusted thermal pad manufacturer providing heat transfer solutions
PID: 2760753
Model No: 0
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Supplier Details
T
T-GLOBAL TECHNOLOGY CO., LTD.
Member Since
2003
Address
No. 33, Ln. 50, Daren Rd., Taoyuan Dist., Taoyuan City 330, Taiwan (R.O.C.)
+886-3-3665666
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Key Features

As a leading thermal pad manufacturer, we specialize in providing high-quality heat transfer solutions designed to meet the demands of modern electronic devices. Our heat transfer pad is engineered for superior thermal conductivity, ensuring efficient heat dissipation in a wide range of applications. Whether it's for consumer electronics, automotive components, or industrial equipment, our products are crafted to deliver consistent performance and reliability, making them the preferred choice for professionals in the field.


The thermally conductive silicone sheet is one of our flagship products, known for its excellent thermal management capabilities. This sheet is designed to bridge the gap between heat-generating components and cooling systems, enhancing the overall efficiency of the device. Its flexibility and conformability allow for easy application, even in complex assemblies, ensuring a perfect fit and optimal heat transfer. The non-silicone formula also makes it suitable for environments where silicone is not preferred or allowed.


Our heat transfer pad is designed to withstand harsh operating conditions, including extreme temperatures and mechanical stress, without compromising on performance. This durability ensures long-lasting protection for sensitive electronic components, reducing the risk of overheating and extending the lifespan of the device. With our advanced materials and precise manufacturing processes, we offer a thermal solution that meets the highest industry standards, providing peace of mind to engineers and designers looking for reliable thermal management options. Please feel free to contact us.

Features
  • High Thermal Conductivity: This thermal pad offers excellent thermal conductivity, ensuring efficient heat transfer between components and cooling systems.
  • Silicone-Free Composition: Made without silicone, this pad is ideal for applications where silicone materials are not preferred or allowed.
  • Ultra-Soft Material: The pad is made from ultra-soft material, providing excellent conformability to uneven surfaces and reducing thermal resistance.
  • Wide Operating Temperature Range: Designed to perform reliably across a broad temperature range, making it suitable for various environmental conditions.
  • Customizable Thickness: Available in different thicknesses to meet specific application requirements, allowing for flexibility in design and usage.
  • Easy to Apply: The pad’s flexibility and softness make it easy to apply, even in complex or tight spaces, ensuring a secure fit.
  • Durable and Reliable: Built to withstand harsh operating conditions, including mechanical stress, ensuring long-lasting performance.
  • Non-Flammable: The pad is non-flammable, adding an extra layer of safety in critical applications.
  • Environmentally Friendly: Manufactured with environmentally conscious materials, reducing its impact on the environment.
  • Enhanced Heat Dissipation: Designed to improve overall device performance by effectively dissipating heat, thereby extending the lifespan of electronic components.

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