As a provider of Thermal Conductive Silicone Pads with High Compressibility, we are committed to delivering top-tier products designed to meet the evolving demands of modern electronics. Our TG-A3500 thermal pads, featuring a thermal conductivity of 3.5 W/m•K, are ideal for electronic devices with mid-to-low heat dissipation needs. This makes TG-A3500 an entry-level option in the high-performance thermal silicone pad range, ensuring effective thermal management for a variety of applications. Our thermal pads excel in bridging gaps between battery modules and other heat sources, addressing the increased thermal demands of increasingly compact and feature-rich electronic devices. Don't hesitate to reach out to us.

Features

• The thermal conductivity of TG-A3500 is 3.5 W/m•K, making it suitable for electronic products with mid-to-low heat dissipation needs. It is an entry-level product in the high-performance thermal silicone pad range.
• This thermal pad, which exhibits excellent thermal conductivity, is commonly used in the gaps between battery modules. As technology advances, electronic devices are becoming smaller and more feature-rich, resulting in higher heat dissipation requirements.
• Using TG-A3500 ultra-soft thermal silicone pads to fill the gaps between heat sources and cooling devices can significantly reduce thermal resistance caused by air gaps, achieving effective heat transfer. All cooling begins with thermal conductivity.

Product applications: 

Electronic components, electric vehicles, 5G, autonomous driving systems, smartphones, IoT, high-performance computing, servers, integrated circuits, central processing units, metal oxide semiconductors, LEDs, motherboards, power supplies, heat sinks, LCD TVs, laptops, personal computers, telecommunications equipment, wireless hubs, DDR II modules, etc.

As a leading supplier of high-performance thermal management solutions, we proudly present our Thermal Conductive Silicone Pad with High Compressibility, TG-A3500. Designed to meet the demands of advanced electronic applications, this product is ideal for addressing the thermal management challenges associated with compact and high-performance electronic devices.

The TG-A3500 thermal pad stands out with its impressive thermal conductivity of 3.5 W/m•K, making it a top choice for electronics with mid-to-low heat dissipation needs. This entry-level product within the high-performance thermal silicone pad range effectively bridges the gap between heat sources and cooling components, ensuring efficient heat transfer and improved device reliability.

Our thermal pad excels in applications where superior thermal conductivity is crucial, such as in battery modules and high-tech electronic assemblies. With the continuous miniaturization and enhancement of technology, electronic devices now feature higher performance capabilities, which in turn generate more heat. TG-A3500 addresses this challenge by reducing thermal resistance caused by air gaps, thanks to its ultra-soft and compressible nature. This characteristic ensures a snug fit in the spaces between components, optimizing heat dissipation and maintaining the performance and longevity of electronic devices.

The TG-A3500 thermal conductive silicone pad is versatile and suitable for a wide range of applications. It is used in various sectors including electronic components, electric vehicles, 5G technology, autonomous driving systems, smartphones, IoT devices, high-performance computing, servers, integrated circuits, central processing units, metal oxide semiconductors, LEDs, motherboards, power supplies, heat sinks, LCD TVs, laptops, personal computers, telecommunications equipment, wireless hubs, and DDR II modules.

Available in yellow, with a thickness ranging from 0.5 to 8.0 mm, and offered in various formats including pad, sheet, and die-cut pad, TG-A3500 meets diverse application needs. With a hardness rating of 30 Shore 00 and a dielectric breakdown voltage of 6 kV/mm, it ensures reliable performance under demanding conditions. Our commitment to quality and innovation is evident in every TG-A3500 pad, providing optimal thermal management solutions for the ever-evolving electronic landscape.