In terms of quality and electronic components are not all qualified at the early stage of production. The burn-in step is needed to pick out the flawed electronic components. According to the statistics, a bath-tube curve shows that some flawed electronic components may be found at the early and late stages of usage but the fraction of flawed electronic components is stabilized after a period of time.

The purpose of this step is to pick out the flawed electronic components, which may be caused by many factors, such as defective manufacturing process and design flaws at the early stage of development. This step will prevent the risk of potential product failure by testing.

PCB specification:

1. Max. ~28 layers (limited by system)

2. Max. thickness: a) HPB5: 4.1 mm; b) LC2: 2.4 mm; c) DI: 1.6 mm. (limited by system)  

3. Copper thickness: a) HPB5: 2 oz; b) LC2: 1 oz; c) DI: 0.5 oz. 

4. Gold thickness: 5 ~ 20 μm

5. Min. BGA pitch: 0.35 mm

6. High power: 50 ~ 150 W

7. High frequency: 15 GHz

8. Max. size: 680 x 570 mm

9. Via on pad: Yes

10. Min. gap: 3 mil

11. Material: Arlon(Polyimide-85N), EM-827_High-TG and DS-7409(FR4 High-TG)