It is necessary to test all functions of IC chips to ensure the product quality during the process of IC encapsulation. The testing includes open/short circuit, power consumption, high-speed signal, etc.. For the purpose of conducting various type of IC testing, load board is designed as an interface between IC and the automatic test equipment (ATE) to transmit electricity and signal. Hence, signal integrity (SI) and power integrity (PI) of load board have to be inspected cautiously to prevent incorrect testing results in IC function.

KEYSTONE MICROTECH has abundant experience for load boards design and specializes in the test solutions for mobile CPU, LCD TV driver chips, server high-speed SERDES chips, RF transceivers, power management IC, etc.. We may provide client with the best circuit design and simulation service of complete electrical characteristics, such as RF, SI and PI at the design stage to accurately estimate the product functions.

PCB Specification:

1. Max. 110 layers

2. Max. thickness: 8 mm

3. Copper thickness: 0.5 ~ 4 o.z

4. Max. gold thickness: 60 μm

5. Aspect ratio: 41

6. Min. gap: 2 mil

7. Min. BGA pitch: 0.3 mm

8. Max size: 750*610 mm

9. Build up: 3+n+3

10. PTH: +/-3 mil

11. NPTH : +/- 2 mil

12. Impedance control: +/- 5~10%

13. Material: Arlon85, Magtron4, Magtron6, FR4, FR5, FR408 and Rogers

*Via on Pad, Blind Via, Open/Short Testing, Co-planarity Measurement & Embedded capacitor: Yes

*Substrate offering: Min. pitch 60 μm for BGA pitch smaller than 0.3 mm.