Classification
Carboxylic Acid
Ball Attach Flux NC-585
PID:
2299773
Model No:
Made in:
United States
Quantity:
1000 Piece(s)Available
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Payment:
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Supplier Details
WINHAN APPLICATION MATERIALS CO LTD
Product Specifications
Key Features
Ball Attach Flux NC-585 is a low viscosity
thixotropic no-clean flux designed for use in
ball attachment to substrates (BGA and PGA
manufacturing). It is especially useful in
applications requiring soldering to surface finishes
with tenacious oxides, such as nickel. It can also
be used wherever a no-clean ball attach flux is
needed, and is suitable for a variety of different
deposition methods.
Attachment
